IsoClad 933 2-Layer 62mil PCB – Flexible RF Substrate with ENIG Finish for Conformal Antenna Applications

1.Introduction of IsoClad 933

IsoClad 933 laminates are nonwoven fiberglass/PTFE composites designed for use as printed circuit board substrates. The unique nonwoven reinforcement structure allows these laminates to be easily used in applications where the final circuit will be bent to shape, making them ideal for conformal or "wrap-around" antennas.

IsoClad 933 products utilize longer random fibers and a proprietary manufacturing process to deliver greater dimensional stability and better dielectric constant uniformity compared to competitive nonwoven fiberglass/PTFE laminates with similar dielectric constants.

2.Key Features

Dielectric Constant: 2.33 @ 10GHz
Dissipation Factor: 0.0016 @ 10GHz
Thermal Coefficient of Dk: -132 ppm/°C
Peel Strength: 10 lbs/inch
Dielectric Breakdown: >45 kV
CTE: X-axis: 31 ppm/°C, Y-axis: 35 ppm/°C, Z-axis: 203 ppm/°C
Flammability Rating: UL-94 V0

3.Benefits

Enhanced flexibility compared to woven fiberglass substrates
Highly isotropic properties in X, Y and Z directions
Excellent dimensional stability
Superior dielectric constant uniformity

4.PCB Construction Details

5.PCB Stackup (2-Layer Rigid Structure)

Copper_layer_1 - 35 μm
IsoClad 933 Core - 62mil (1.575 mm)
Copper_layer_2 - 35 μm

6.PCB Statistics:

Components: 66
Total Pads: 192
Thru Hole Pads: 120
Top SMT Pads: 72
Bottom SMT Pads: 0
Vias: 231
Nets: 2

7.Typical Applications

Conformal Antennas
Stripline and Microstrip Circuits
Missile Guidance Systems
Radar and Electronic Warfare Systems

8.Quality Assurance

IPC-Class 2 compliant
100% electrical tested
Global availability
Gerber RS-274X support